Oppo reportedly is working on a smartphone chipset for 2023, built by TSMC using 6nm process node
Because the 5nm Tensor chip was customized by Google, it allowed the company to create features for the Pixel 6 line that could not have been included if an off-the-shelf chip had been used instead.
Now, BBK Electronics’ Oppo wants to follow the same path. It has already designed its own Image Signal Processor, NPU, and custom memory architecture that it calls the MariSilicon X. The chip processes Oppo’s noise reduction algorithm 20 times faster while using half the power of a Snapdragon 888 powered smartphone.
The only information we have about Oppo’s self-designed AP is the 6nm process node that it will be manufactured on next year. That would suggest that the phones that the chip will be driving next year will probably not be flagship models. Most likely next year’s chip production will be a test for Oppo to see whether it should continue to design better chips every year eventually working its way up to designing the chips for its own flagship phones.
Oppo expected to follow in 2024 with 4nm chip developed for more powerful phones
The 4nm chipset that Oppo is planning for 2024 is closer to being flagship material than the component expected to be mass produced next year. We also wonder what this news means to Oppo’s OnePlus sub unit. This news could indicate that OnePlus will use Oppo designed chipsets in the future. Currently, Oppo’s flagship phone is powered by Qualcomm’s Snapdragon 8 Gen 1 chip.
Once upon a time, Huawei was another firm that designed its own chips via its HiSilicon unit. But in 2020 the U.S. Commerce Department changed its export rules to make it extremely difficult for the Chinese manufacturer to obtain cutting-edge chips for its phones, even ones that it designed itself. Under the rule change, any foundry using American technology to build cutting-edge chips cannot ship such chips to Huawei.